YAXUN Solder Paste High Temperature Melting Point 183c For CPU Reballing YX308

Description:

The YAXUN YX308 Solder Paste is a high-temperature soldering compound specially formulated for precision electronic repairs, including CPU, BGA, and SMD reballing. With a melting point of 183°C, it delivers reliable solder flow, strong joints, and excellent heat resistance. Designed for professionals, it ensures smooth application and consistent results on delicate electronic components.

Features:

High Temperature Formula: Melting point at 183°C for stable and durable soldering.

Excellent Conductivity: Ensures strong electrical connections with minimal resistance.

Smooth and Consistent Texture: Easy to apply and spreads evenly during soldering.

Oxidation-Resistant: Reduces defects and provides clean, shiny solder joints.

Perfect for BGA/CPU Reballing: Ideal for high-precision electronic repair work.

Long Shelf Life: Maintains quality and consistency even after storage.

Professional Grade: Trusted by technicians for mobile, computer, and PCB repair.