YAXUN Low Temperature Solder Paste YX309

Description:

The YAXUN YX309 Low Temperature Solder Paste is specially formulated for precision electronic soldering where heat sensitivity is a concern. Designed to melt at lower temperatures, it prevents damage to delicate components such as smartphone PCBs, flex cables, and microchips. It provides smooth solder flow, strong joint bonding, and minimal residue — perfect for professional repair technicians and hobbyists alike.

Features:

Low Melting Point Formula: Ideal for soldering heat-sensitive electronic parts safely.

Smooth Consistency: Easy to apply with even spreading for clean, professional results.

Strong Bonding Strength: Creates reliable solder joints with excellent electrical conductivity.

Oxidation Resistant: Ensures bright, durable solder joints and reduces rework.

Fast Wetting and Flow: Improves work efficiency and solder precision.

Low Residue & Easy Cleaning: Leaves minimal flux residue after soldering.

Perfect for Professional Repair Work: Suitable for smartphones, laptops, and microelectronics.